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    • 专利摘要:
    Electronic device (100) that can be mounted in an electric motor, comprising: a printed circuit board (110) with an opening (111) for mounting a semiconductor package (120) comprising an integrated magnetic measuring device, the semiconductor package (120) comprising pins (121); and reinforcement material (130); the semiconductor package (120) being mounted in the opening with the pins (121) soldered to the printed circuit board, and a gap (112, 113) being present between the semiconductor package (120) and the printed circuit board (110), the reinforcement material (130) covers at least a portion of the pins (121) and at least a portion of the circuit board (110).
    公开号:BE1025927B1
    申请号:E20185892
    申请日:2018-12-17
    公开日:2020-03-09
    发明作者:Dirk Leman
    申请人:Melexis Bulgaria Ltd；
    IPC主号:
    专利说明:

    Field of the Invention. Amplified Electronic Device for an Electric Motor
    The invention relates to the field of electronic devices comprising printed circuit boards. More specifically, it relates to electronic devices that can be mounted in an electric motor.
    Background of the invention
    Electronic motors have recently become increasingly smaller in diameter. The electronic motors include printed circuit boards, which include a drive mechanism and magnetic measurement electronics (PCBs). For correct fan operation, the exact location of the magnetic measurement electronics relative to the permanent magnet motor is extremely important for motor operation. By reducing the diameter and thickness of the printed circuit board, it is possible to reduce the diameter and thickness of the electronic motor. This is beneficial, for example, for fan motors. Due to the size limitations, the PCBs have also decreased in thickness. This can result in mechanical stress and deformation of the PCB during mounting of the PCB in the motor. Together with vibrations during application work of the motor, this mechanical stress can wear the soldering of small transistors with small outer dimensions with straight pins and thus contribute to malfunction of the motor application, eg the fan.
    An example of a prior art electronic device 10 mountable in an electric motor illustrated in FIG. 1. It comprises a PCB 11 with an opening 12 for it
    BE2018 / 5892 mounting a semiconductor package 13. The semiconductor package 13 can for instance be an integrated package with small outer dimensions with 8 pins (SOIC8). The PCB has a disk-like shape with a central through-hole 14 through which the motor shaft can extend. Such an electronic device can be adapted, for example, for detecting positional information of the motor by means of a Hall sensor and for operating power switching elements for driving the electronic motor (e.g. the brushless DC motor).
    FIG. 2 shows a cross section of the semiconductor package 13 and a portion of the PCB 11 and illustrates how the semiconductor package 13 is mounted in the opening 12 by pins 17, the pins in this example being straight pins.
    Another effect of this prior art solution may be acoustic noise caused by mechanical semiconductor package oscillations generated by motor vibrations.
    US4773829A discloses an electric motor with a protective housing, the protective housing also including at least one printed circuit board for supporting the motor control circuit. The fan motor housing has an annular extension corresponding to the fan housing and the printed circuit board is housed in said extension and placed in substantially parallel relationship with the fan housing washer. The presence of the annular extension makes it possible to give the printed circuit board a diameter equal to that of the
    BE2018 / 5892 washer of the fan housing. This diameter is sufficient to house all components of the circuit without the need to provide an additional housing, regardless of the power and thus the dimensions of the fan.
    In view of the requirements for reducing the size of the motor, there is a need to reduce the size of electronic devices so that they can be mounted in an electric motor without the need for an annular extension in the motor housing.
    Summary of the invention
    It is an object of embodiments of the present invention to provide a good electronic device that can be mounted in an electronic motor and a method of producing such an device.
    The above stated object is achieved by a method and apparatus according to the present invention.
    In a first aspect, embodiments of the present invention pertain to an electronic device that can be mounted in an electric motor. The facility includes:
    - a printed circuit board with an opening for mounting a semiconductor package comprising an integrated magnetic measuring device, the semiconductor package comprising pins,
    - and reinforcement material,
    - with the semiconductor package mounted in the opening with the pins soldered to the circuit board,
    BE2018 / 5892 and where there is a gap between the semiconductor package and the printed circuit board,
    - wherein the reinforcing material covers at least a part of the pins and at least a part of the printed circuit board.
    In embodiments of the present invention, the reinforcement material can attach the pins to the circuit board. In embodiments of the present invention, the reinforcement material can also improve the rigidity of the printed circuit board.
    Circuit boards (PCBs) with an aperture, where the aperture is large enough for mounting a semiconductor package, may have reduced stiffness when the area of the PCB is reduced. This is especially the case due to the presence of the opening. When the semiconductor package is mounted in the opening, a gap is provided to ensure that the package fits in the opening. It is an advantage of embodiments of the present invention that the rigidity of the electronic device is increased by covering the pins and at least a portion of the PCB with reinforcement material. This allows an even greater reduction in the area of the electronic devices. This is particularly suitable for electronic devices to be integrated into an electric motor, especially in applications where the size of the motor is a critical parameter (eg fans).
    In embodiments of the present invention, the reinforcement material covers at least a portion of the semiconductor package, at least one
    BE2018 / 5892 part of the slit and at least part of the printed circuit board.
    It is an advantage of embodiments of the present invention that the stiffness of the plate is increased even more by reinforcing material covering the semiconductor package and at least a portion of the gap. In embodiments of the present invention, the reinforcing material may even cover the semiconductor package, the opening and at least a portion of the PCB on both sides of the plate.
    In embodiments of the present invention, the gap is at least partially filled with the reinforcement material.
    It is an advantage of embodiments of the present invention that the stiffness of the plate is increased even more by reinforcing material that fills at least a portion of the gap between the semiconductor package and the PCB. In embodiments of the present invention, the reinforcement material completely fills the gap between the semiconductor package and the PCB around the semiconductor package.
    In embodiments of the present invention, the reinforcing material includes a material that changes and cures its material properties after being applied.
    It is an advantage of embodiments of the present invention that the reinforcing material comprises a material that is flexible when applied (for example, the reinforcing material can be liquid, and can be spread through a manifold) and which cures after application. This
    BE2018 / 5892 allows good application of the reinforcement material, especially on an uneven surface.
    In embodiments of the present invention, the reinforcing material comprises an epoxy or a resin.
    In embodiments of the present invention, the printed circuit board comprises only one layer.
    It is an advantage of embodiments of the present invention that even a thin plate comprising only one layer can be made sufficiently strong by the reinforcing material covering at least the pins and at least a portion of the printed circuit board. If no gap is provided, a more expensive double-layer circuit board would have to be produced to fit the hall sensor near the rotor. Also, the fan would be thicker, or more unusual packages like 0.4mm thick UTDFN (ultra thin dual flat no leads - ultra-thin dual flat no pins) should be fitted, which are more complex and expensive to produce.
    In embodiments of the present invention, the pins of the semiconductor package are straight pins.
    It is an advantage of embodiments of the present invention that the electronic device is more compact than an electronic device, the semiconductor package not mounted in the opening and / or the semiconductor package having no straight pins.
    In embodiments of the present invention, the semiconductor package includes an integrated magnetic measuring device.
    BE2018 / 5892
    In a second aspect, embodiments of the present invention pertain to an electronic motor comprising an electronic device according to embodiments of the present invention, the electronic device being mounted in a housing of the electronic motor.
    It is an advantage of a motor according to embodiments of the present invention that it is compact because the electronic device is integrated into the motor housing. Mounting the electronic device in the motor housing also ensures that the semiconductor package is close to the rotor. This is especially advantageous when the semiconductor package is used to provide rotor position information. This can be achieved, for example, by a semiconductor package that includes a magnetic measuring device and that incorporates a varying magnetic field induced by the rotating rotor. In that case, it is important that the semiconductor package is close to the rotor. In addition, it is advantageous that the strength of the electronic device is increased by the reinforcing material covering at least a portion of the pins (or the entire pins) and at least a portion of the printed circuit board. An increased PCB strength makes a fan more mechanically stable and therefore less sensitive to vibrations that lead to audible noise.
    In a third aspect, embodiments of the present invention pertain to a method of producing an electronic device comprising an integrated magnetic measuring device that can
    BE2018 / 5892 are mounted in an electric motor, the method comprising:
    - providing a printed circuit board with an opening for mounting the semiconductor package in the opening,
    - applying a solder paste to the printed circuit board,
    - mounting a semiconductor package comprising pins on the printed circuit board so that the pins are in contact with the solder paste and so that there is a gap between the semiconductor package and the printed circuit board,
    - applying reinforcing material so that it covers at least the pins and at least a part of the printed circuit board, the reinforcing material being such that it changes its material properties and hardens after being applied,
    - the liquid soldering of the semiconductor package before or after the application of the reinforcement material.
    It is an advantage of embodiments of the present invention that the strength of the electronic device increases by applying reinforcing material so that it covers at least the pins and at least a portion of the printed circuit board.
    In embodiments of the present invention, flow soldering occurs after the step of applying the reinforcement material.
    It is an advantage of embodiments of the present invention that the reinforcing material hardens even more during flow. It is an advantage of embodiments of the present invention that the chance of failure during assembly
    BE2018 / 5892 solder joints are reduced by applying the reinforcement material that increases PCB strength and thus reduces the chance of deformation of the device leading to failed solder joints.
    In embodiments of the present invention, the flow soldering is done before applying the reinforcing material.
    It is an advantage of embodiments of the present invention that solder inspection can be performed before applying the reinforcement material.
    In embodiments of the present invention, the reinforcing material is applied as a liquid.
    It is an advantage of embodiments of the present invention that the reinforcing material can be easily applied if it is in liquid form during application.
    In embodiments of the present invention, the reinforcement material is applied so that it covers at least a portion of the semiconductor package, at least a portion of the slit, and at least a portion of the printed circuit board.
    It is an advantage of embodiments of the present invention that the strength of the electronic device can be increased even more by applying the reinforcement material over at least a portion of the semiconductor package (or even the entire semiconductor package), at least a portion of the slit (or the full slit), and at least a portion of the printed circuit board than in embodiments
    BE2018 / 5892 in which the reinforcement material covers the pins and at least a part of the printed circuit board.
    In embodiments of the present invention, the reinforcing material is applied
    On both sides of it semiconductor package and the PCB.It is an advantage from embodiments from the present invention Which the strength of the
    electronic device can be increased even more by applying the reinforcing material to both sides of the semiconductor package and the circuit board.
    Specific and preferred aspects of the invention are included in the accompanying independent and dependent claims. Features of the dependent claims may be combined with features of the independent claims and features of other dependent claims as appropriate and not merely as expressly contained in the claims.
    These and other aspects of the invention are clearly explained and explained with reference to the embodiment (s) described below.
    Brief description of the drawings
    FIG. 1 shows a PCB layout of a prior art electronic device comprising an aperture and a semiconductor package mounted in the aperture that can be mounted in an electric motor.
    FIG. 2 shows a cross section of the semiconductor package and a portion of the PCB of FIG. 1.
    FIG. 3 shows a schematic cross-sectional view of a portion of an electronic
    BE2018 / 5892 device comprising reinforcing material according to embodiments of the present invention.
    FIG. 4 shows a schematic drawing of a top view of the same electronic device as in FIG. 3, the opening being realized as a U shape on the side of the PCB according to embodiments of the present invention.
    FIG. 5 shows a top view of a semiconductor package and portion of the PCB, with the opening realized in the PCB, which can be mounted as an electronic device according to embodiments of the present invention.
    FIG. 6 shows a schematic cross-sectional view of a portion of an electronic device comprising reinforcing material covering the semiconductor package according to embodiments of the present invention.
    FIG. 7 shows a schematic drawing of a top view of the same electronic device as in FIG. 6.
    FIG. 8 shows a schematic cross sectional view of a portion of an electronic device comprising reinforcing material covering the semiconductor package, the opening and at least a portion of the PCB on both sides of the PCB.
    FIG. 9 shows a schematic drawing of a top view of the same electronic device as in FIG. 8.
    FIG. 10 shows a schematic drawing of an electronic device, in which the reinforcement material covers only part of the pins and part of the printed circuit board.
    BE2018 / 5892
    FIG. 11 shows a schematic drawing of an electronic device, the reinforcement material also covering the gap between the printed circuit board and the semiconductor package.
    FIG. 12 shows an example of a straight pin package with cut pins that can be mounted in an opening on a PCB of an electronic device according to embodiments of the present invention.
    FIG. 13 shows a schematic cross-sectional view of a portion of an electronic device comprising reinforcing material, the semiconductor package comprising only pins on one side of the package according to embodiments of the present invention.
    FIG. 14 shows a schematic drawing of a top view of the same electronic device as in FIG. 13.
    FIG. 15 shows a semiconductor package comprising pins that have a non-straight shape that can be mounted in an opening of a PCB of a semiconductor device according to embodiments of the present invention.
    FIG. 16 shows a schematic drawing of a portion of an electronic motor according to embodiments of the present invention.
    FIG. 17 shows a schematic drawing of a portion of an electronic motor comprising a flat rotor according to embodiments of the present invention.
    BE2018 / 5892
    FIG. 18 shows the flow chart of a characterizing method according to embodiments of the present invention.
    FIG. 19 shows a flow chart of a sequence of steps of a characterizing method according to embodiments of the present invention, wherein the flow soldering is done before applying the reinforcing material.
    FIG. 20 shows a flow chart of a sequence of steps of a characterizing method according to embodiments of the present invention, wherein the reinforcing material is applied before flow soldering.
    The reference characters in the claims should not be interpreted as limiting the objective.
    In the different drawings, like reference characters refer to like or analogous elements.
    Detailed description of illustrative embodiments
    The present invention is described with reference to specific embodiments and with reference to certain drawings, but the invention is not limited thereto but only to the claims. The drawings described are purely schematic and not limiting. In the drawings, the size of some of the elements may be exaggerated and not drawn to scale for illustrative purposes. The dimensions and the relative dimensions do not correspond to actual reductions for the practice of the invention.
    BE2018 / 5892
    In addition, the terms above, below, and the like in the description and claims are used for descriptive purposes and not necessarily for describing relative positions. It is understood that the terms thus used are interchangeable under appropriate conditions and that the embodiments of the invention described herein may operate in orientations other than those described or illustrated herein.
    It is to be noted that the term "comprising" used in the claims should not be interpreted as being limited to the agents listed below; it does not exclude other elements or steps. It should therefore be interpreted as specifying the presence of the listed attributes, integers, steps or components referenced, but does not exclude the presence or addition of one or more other attributes, integers, steps or components, or groups thereof. from. Thus, the meaning of the term "a device comprising means A and B" should not be limited to devices consisting only of components A and B. This means that, with respect to the present invention, the only relevant components of the device are A and B .
    Reference throughout this specification to "a particular embodiment" or "an embodiment" means that a specific property, structure or feature described in relation to the embodiment is included in at least one embodiment of the present invention. The inclusions of the terms "in a particular embodiment" or "in an embodiment" at various locations throughout this specification do not necessarily all refer to
    BE2018 / 5892 the same embodiments, but they can. Furthermore, the specific properties, structures or features may be combined in any suitable manner, as is apparent from this disclosure to anyone skilled in the art, in one or more embodiments.
    Likewise, it should be understood that in describing the exemplary embodiments of the invention, various features of the invention are sometimes grouped together in a single embodiment, figure, or description thereof to streamline disclosure and assist in understanding one or more of the various aspects of the invention. However, this disclosure method should not be construed as an intention that the claimed invention requires more features than stated explicitly in any claim. Instead, as shown in the following claims, inventive aspects lie in less than all features of a single embodiment disclosed therefor. Thus, the claims that follow the detailed description are expressly included in this detailed description, each claim standing alone as a separate embodiment of this invention.
    Furthermore, while some embodiments described herein include some but not other features included in other embodiments, combinations of features of different embodiments are intended to be within the scope of the invention, and constitute different embodiments, as is apparent to those skilled in the art . For example, in the following
    BE2018 / 5892 claims, any of the claimed embodiments can be used in any combination.
    Various specific details are included in the description provided herein. It is clear, however, that embodiments of the invention can be practiced without these specific details. In other instances, known methods, structures and techniques have not been presented in detail in order not to compromise the clarity of the description.
    In a first aspect, embodiments of the present invention pertain to an electronic device 100 configured to be mounted in an electric motor. The device comprises a printed circuit board 110 with an opening 111 for mounting a semiconductor package 120. A semiconductor device is packaged in such a semiconductor package. The semiconductor package 120 includes pins 121 and reinforcement material 130, with the semiconductor package 120 mounted in the opening 111 with the pins 121 soldered to the circuit board 110, the reinforcement material 130 at least a portion of the pins 121 (or the full pins) and covers at least a portion of the printed circuit board 110. In embodiments of the present invention, the reinforcement material also fills at least a portion of the gap 112 between the main portion (i.e., the outer surface) of the semiconductor package 120 and the PCB (e.g., the gaps 112 on the sides of the PCB 110 where the pins 121 present). For example, the electric motor can be a permanent magnet brushless motor.
    BE2018 / 5892
    FIG. 3 shows a schematic cross-sectional view of such electronic device 100 according to embodiments of the present invention. A cross section of the semiconductor package 120 and the PCB is shown. In this example, only a portion of the PCB including the opening 111 is shown, with the semiconductor package 120 mounted. For example, the PCB may still extend to form a disk-like shape with a central through hole through which a motor shaft can extend.
    FIG. 4 shows a schematic drawing of a top view of the same electronic device as in FIG. 3. The semiconductor is packaged in a SOIC8 package comprising 8 straight pins. Due to the presence of the aperture 111, the PCB has a reduced size between its outer edges and the aperture 111. This is the remaining interconnecting portion 141. The electronic device is reinforced by the reinforcement material 130 which also includes the gaps 112 on the sides of the PCB 110, where pins 121 are present. In this example illustrated in FIG. 3 and FIG. 4, the gap 113 on the side of the PCB 110 where the pins 121 are not present is not filled with reinforcement material.
    As shown in FIG. 4, the opening 111 can be realized as a U-shape on the side of the PCB; in this case, the opening is defined on three sides by the PCB. In the case of a three-sided opening, there is only an inner remaining interconnecting
    BE2018 / 5892 section 141 (e.g. corresponding to interconnecting section 16 in FIG. 1).
    An alternative embodiment is shown in FIG. 5, in which the opening is located in the PCB, the opening being defined on the four sides by the PCB. In the case of a four-sided opening, there is also an outer remaining interconnecting portion 142. In the rest of the text, an opening refers to either a three-sided or a four-sided opening, and the inner and outer remaining interconnecting portions refer to the remaining interconnecting connecting portion 140. In the example of FIG. 5, the reinforcement material has not yet been applied.
    As can be seen in the prior art example illustrated in FIG. 1, the weakest point of the PCB is at the location of the opening 12 for attaching the semiconductor package where the interconnecting PCB members 15, 16 become thinnest. Thus, with the transition to smaller PCBs, the PCB opening 12 becomes the limiting factor for PCB stiffness.
    By providing reinforcing material 130 covering at least a portion of the pins 121 and at least a portion of the printed circuit board 110, the strength of the PCB 110 is significantly increased.
    The reinforcement material 130 may even cover at least a portion of or even the entire semiconductor package 120, the opening 111, and at least a portion of the printed circuit board 110 to further increase the strength. This is illustrated in FIG. 6 and FIG. 7, showing a cross-section and a top view of such an electronic device, respectively
    BE2018 / 5892. In embodiments of the present invention, the reinforcement material fills the gap between the semiconductor package 120 and the PCB 110. This is also illustrated in FIG. 6 and FIG. 7 as well as in FIG. 8 and FIG. 9. In these figures, the gap 112, 113 between the semiconductor package and the PCB is completely filled around the semiconductor package with reinforcement material. Also those parts of the slit 113 located on the sides of the semiconductor package that do not include pins are filled with reinforcement material.
    In embodiments of the present invention, the reinforcement material 130 may even cover at least a portion of the semiconductor package 120, at least a portion of the slit, and at least a portion of the PCB 110 on both sides of the PCB. This is illustrated in FIG. 8 and FIG. 9, which respectively show a cross-section and a top view of such an electronic device. By applying the reinforcing material to both sides of the PCB, the rigidity of the PCB can be increased even more.
    It is an advantage of embodiments of the present invention that reinforcing material covers at least a portion of the pins of a semiconductor package mounted in the opening of a printed circuit board, or even covers at least a portion of the gap between that printed circuit board and the semiconductor package, whether it even fills at least partially. The epoxy can be distributed over the entire package to maximize PCB strength. This is especially advantageous for printed circuit boards with a shape adapted to fit a device such as an electric one
    BE2018 / 5892 engine. Because the adaptation can result in reduced rigidity (eg some parts of the plate can be removed). Therefore, it is an advantage of embodiments of the present invention that the rigidity is increased by the reinforcement material covering at least the pins of the printed circuit board mounted in the opening of the semiconductor package. In embodiments of the present invention, the plate can be a circular plate. It may have a disc shape or an incomplete disc shape in which some parts have been removed so that the circuit board fits better in a device. The inner diameter of the motor and the outer diameter of the electronic device can be such that the electronic device fits into the motor when it is mounted in the motor with its surfaces perpendicular to the motor shaft.
    In embodiments of the present invention, the amount and range of the epoxy distribution is limited to reduce the cost of the reinforcing material (by reducing the total amount used, and to reduce the time required for distribution.
    The reinforcing material can thus only be distributed on the pins, and even only over a part of the pins. As will be described in the method steps, the distribution of the reinforcing material can be done before or after soldering. Particularly in the case of distribution before soldering, distribution of the reinforcing material over a portion of the pins is useful because it attaches the pins to the PCB and
    BE2018 / 5892 minimizes warping of the PCB during flow soldering.
    During flow soldering, a difference in expansion coefficients (CTE) between the PCB and the semiconductor package can cause distortion.
    If the opening 111 in the PCB 110 is a three-sided U-shape, the PCB may be subject to severe warping due to heating of the PCB.
    Applying the reinforcing material before flow soldering prevents the pins from rising out of the solder paste during heating and / or cooling, which could result in a weak or no solder joint at all.
    In case of distribution over or in the gap 112, 113 between the semiconductor package and the printed circuit board 110, higher viscosity epoxy may be required to prevent dripping.
    An example in which the reinforcement material 130 covers only a portion of the pins 121 and a portion of the printed circuit board 110 is illustrated in the schematic drawing of FIG. 10. In this example, the reinforcement material covers only the solder joints. If the gap 112, 113 between the circuit board 110 and the semiconductor package 120 is not covered, dripping of the reinforcement material cannot be avoided. Therefore, a lower viscosity reinforcing material can be used than when the reinforcing material also covers the gap 112, 113 between the circuit board 110 and the semiconductor package 120. The latter case is illustrated in FIG. 11. In this case, the reinforcement material preferably does not drip when applied to the pins and to the PCB,
    BE2018 / 5892 especially on the positions covering the gap. In embodiments of this invention, it is also possible to limit the gap with narrow tolerances so that the capillary effects can allow the use of lower viscosity reinforcing materials.
    In view of the need to limit space in an electronic motor, it should be borne in mind that the increase in thickness of the electronic device is limited by the provision of the reinforcement material. The reinforcement material should not protrude so far that it will no longer fit into the motor structure (eg, fan motor structure) or block the motor rotation. For example, by arranging the PCB opening in the inner diameter of the rotor. In this case, the protrusions will not touch the rotor.
    In embodiments of the present invention, the reinforcing material includes a material that changes and cures its material properties after being applied. The material can be an epoxy or a resin or a similar material that cures after application. Some of these materials can be described as glob-top materials. The reinforcement material can also be a ribbon that can be placed over the pins and the PCB and which clings tightly to the pins during flow.
    The table below lists MasterBond epoxy materials:
    BE2018 / 5892
    Type Cureding Curing temp. Curingtime Droping App.Temp.Range UV15X-2GT UV Room 5 mins0 / + 120° C 3HTND-2GT Warmth 150 ° C 5-10 min70/200° C EP21ND Warmth 150 ° C 5-10 min No 50 / + 120° C EP51ND Warmth 90 ° C 5 mins No 70 / + 120° C
    For example, the reinforcing materials can be cured by UV or by heating or by any other method of stabilizing the reinforcing material.
    In embodiments of the present invention, the PCB may comprise one or more layers. Vents are typically provided for sensor-mounted permanent magnetic BLDC motors. The magnetic sensors are then mounted in the openings to be close enough to the permanent magnets on the rotor to measure their magnetic field lines with sufficient signal force. A single-sided PCB (1s0p according to the JEDEC standard) allows 15 simplification of the motor production steps by soldering all SMD components on one side, and mounting the PCB on the
    BE2018 / 5892
    4 stator, can be easily performed with through hole soldering on the same side of the PCB. Therefore, single layer PCBs with openings are very popular for such motors. In some cases, the opening can be applied to a multi-layer PCB. For example, because the PCB space is too large, or the PCB is too thick, and / or more signal line speed can be applied to electrically connect the electrical components on the PCB, or to spread more energy from the board . Regardless of the number of layers of the PCB, it is advantageous to reinforce the PCBs with reinforcement material covering at least a portion of the pins and at least a portion of the printed circuit board.
    For example, in embodiments of the present invention, the semiconductor package may be a small outer size transistor (SOT) or a small outer size integrated circuit (SOIC) comprising straight pins, or even SIP packages with cut pins as shown in FIG. 12, wherein a significant portion, for example 0.1 mm to 1 mm or even 2 mm, of the outside of the pin is straight or flat, i.e., not curved. However, the invention is not limited to this. In the example, the pins are cut to 1.54 mm. Straight pin packages provide the advantage that the package can be easily and stably mounted in the PCB opening while allowing a minimum size solder joint for reliable electrical contact, ensuring operation over a long period of time. Mounting in the PCB opening allows mounting in motor structures at a distance relatively
    BE2018 / 5892 close to the permanent magnets on the rotor. This is advantageous, for example, when the semiconductor package includes a magnetic detection device by determining the rotor positions. In that case, it is important that the magnetic detection device in the semiconductor package is positioned sufficiently close to the permanent magnets on the rotor so that it can provide rotor position information to the brushless motor controller. In embodiments of the present invention, the magnetic detection device integrated into the electronic device includes a Hall sensor.
    In FIG. 13, the semiconductor package 120 includes only pins on one side of the package. In this example, the side of the pins but also the opposite side is covered with reinforcement material 130. Also the gap 112 between the semiconductor package 120 and the PCB 110 on the side of the pins 112 is at least partially filled with reinforcement material 130.
    FIG. 14 shows a schematic drawing of a top view of the same electronic device as in FIG. 13. As can be seen in this figure, the gap 113 between the semiconductor package 120 and the PCB 110 in the example is not covered with reinforcement material. In other examples, this slit may also be covered. It can also be partially or completely filled.
    In the previous example, the pins were straight in shape. In other embodiments of the present invention, some parts of the pins may have a non-straight shape, as shown in FIG. 15. They can be specifically shaped so that the semiconductor package 120 can become deeper in the opening 111
    BE2018 / 5892 fitted. In that case, the gap between the semiconductor package and the circuit board may be wider.
    The gap between the semiconductor package and the printed circuit board may be less than 3 mm, or even less than 1 mm, or even less than 0.5, or even less than 0.3 mm, or even less than 0.2 mm. The slits are typically about 0.1 mm. Standard curved-pin packages can also be applied; however, these are difficult to mount stably in the PCB opening.
    In a second aspect, embodiments of the present invention pertain to an electronic motor 300 comprising an electronic device according to embodiments of the present invention, the electronic device being mounted in a housing of the electronic motor 300. The electric motor may be, for example, a permanent magnet brushless DC motor. A part of such a motor 300 is schematically shown in FIG. 16. It shows a rotor 310 comprising permanent magnets 311. A stator coil 321, a bearing 322 on which a rotor 310 can be mounted. The figure also shows a PCB 110 mounted on the stator 320 and a semiconductor package 120 in an opening 111 in the PCB. A semiconductor device (integrated circuit) is mounted in the semiconductor package 120. In this example, this semiconductor device comprises a magnetic sensor. The stator 320 and the mounted PCB can be mounted in an electronic motor housing.
    The total internal thickness 330 of the motor (e.g. the internal height of the fan) includes the thickness 331 of the PCB, the PCB space 332 between the PCB and the
    BE2018 / 5892 rotor 310, and the height 333 of the rotor. For example, the PCB thickness 331 can vary between 0.8 (see image example) and 1.5 mm. In some cases, the PCB thickness 331 may even be as little as 0.4mm. For example, the PCB space 332 can vary between 0.1 mm and 5 mm. For example, the height 333 of the rotor can vary between 0.1 mm (in the case of a flat rotor, see FIG. 17) and 20 mm. For example, the opening can have a width 340 (between the sides where the pins 121 of the semiconductor package are mounted) between 0 mm and 1 mm outside the dimensions of the package body (ie, the dimensions of the gap between the semiconductor package mounted in the opening and the circuit board).
    PCB thickness 331 and package height play an important role in achieving the thinnest possible fan design. A minimum PCB space 332 is required between rotor and PCB to explain mechanical instability, vibrations and production tolerances.
    FIG. 17 shows an electronic motor comprising a flat rotor according to embodiments of the present invention. The same components are shown as in FIG. 16. However, the rotor's flat design allows the thickness of the motor to be further reduced.
    The use of straight pin packages allows the thickness of the fan driver to be largely absorbed. Using straight pin packages, the hall sensor can be positioned close to the permanent magnets to ensure strongest magnetic field strength at the location of the hall sensor.
    BE2018 / 5892
    Straight pin packages also allow easy soldering of the SMD components on one side of a single layer (1s0p) plate, further reducing the cost for the PCB.
    One means of reducing the fan thickness is by reducing the PCB thickness. However, thinning the PCB will make the PCB less stable. Therefore, it is advantageous that PCBs comprising an opening are reinforced by the reinforcing material covering at least a portion of the pins and at least a portion of the printed circuit board according to embodiments of the present invention.
    In a third aspect, embodiments of the present invention pertain to a method 200 for producing an electronic device that can be mounted in an electric motor. An exemplary method, according to embodiments of the present invention, is illustrated in the flow chart in FIG. 18. The method includes:
    - providing a printed circuit board 210 with an opening for mounting the semiconductor package in the opening,
    - applying a solder paste 220 to the printed circuit board,
    mounting 230 a semiconductor package comprising pins on the printed circuit board so that the pins contact the solder paste and so that a gap is present between the semiconductor package and the printed circuit board,
    arranging reinforcing material 240 so that it covers at least the pins and at least a portion of the printed circuit board, the
    BE2018 / 5892 reinforcement material is such that it changes its material properties and hardens after being applied,
    flow soldering 250 of the semiconductor package before or after applying the reinforcement material.
    The application of the reinforcement material can be done before or after the flow insulation. In both cases, the strength of the electronic device is increased. In embodiments of the present invention, the reinforcement material is arranged to fill at least a portion of the gap between the semiconductor package (mounted in the opening) and the PCB. The strength of the electronic device is thus increased even more. The reinforcement material can be applied to both sides of the PCB and the semiconductor package.
    For example, the flow step can be followed by a visual inspection step and / or an electronic conductivity check. For example, the reinforcement can be applied after the visual inspection step.
    The step of applying the reinforcing material is followed by a baking or UV stabilizing step or another step of stabilizing the reinforcing material. Stabilizing the reinforcement material before the flow insulation reaches its peak temperature at which the solder joints are formed has the advantage that the number of failed solder joints can be reduced because the pins are attached to the PCB and the strength of the electronic device is increased by applying the reinforcement material through which
    BE2018 / 5892 PCB deformation is reduced. In addition, if the curing can be done at temperatures lower than the peak flow temperature at which the solder joints are formed, the reinforcement material may cure as part of the first temperature increase in the temperature profile of the flow solder. This keeps the pins in a good position for good solder connection to electronic contacts (e.g. faces, tracks) on the PCB.
    The steps by which the electronic device is produced can be followed by a step in which the electronic device is mounted in a brushless DC motor.
    FIG. 19 shows a flow chart of a sequence of steps of a characterizing method 200 according to embodiments of the present invention. The application of the solder paste 220 to the PCB is done by a solder pattern printing step. The step is followed by step 230 where the semiconductor package is mounted in the opening of the PCB. During this step, various components can be placed on the PCB. The mounting step is followed by a flow soldering step 250, after which the reinforcing material is applied 240. In this example this is done by epoxy distribution. However, the invention is not limited to epoxy distribution. Other reinforcement materials can also be applied. The epoxy distribution step is followed by a heat / UV cure 241. Other steps that may follow are an in-circuit test 260 and a panel partition 270.
    BE2018 / 5892
    FIG. 20 shows a flow chart of a sequence of steps of a characterizing method 200 according to embodiments of the present invention. This example differs from the example in FIG. 19 in that the reinforcing material 240 is applied before the flow isolation step 250. Also the heat / UV curing step 241 is done before the flow isolation step 250.
    If the reinforcing material (e.g. epoxy) is distributed on the pins before flow insulation, the reinforcing material can attach the pins more firmly to the PCB and thus strengthen the PCB. As a result, warping of the PCB can be reduced. In addition, the pins can be held in position relative to the PCB during flow insulation. The reinforcement material can be cured with UV before flow insulation and / or by means of the heat of the flow profile. Optionally, the flow profile can be slightly adjusted to have optimal curing, for example at 160 ° C, before going through the peak temperature of, for example, 260 ° C for lead-free soldering. During cooling, the mismatch between expansion coefficients (CTE) between the PCB and the semiconductor package makes the semiconductor package sliding position, preventing weak or broken solder joints.
    The reinforcement material can also be applied after the flow insulation (e.g., when warpage of PCB is limited and the straight pin component can be soldered reliably).
    BE2018 / 5892
    In addition, the presence of the reinforcing material covering at least a portion of the pins of a semiconductor package mounted in an opening in a PCB and at least a portion of the PCB has additional advantages. For example, during ICT (in-circuit testing) on the PCB panel, the pogo pins can bend the PCB. The added reinforcement material (e.g. glob-top) strengthens the PCB as a whole and limits the stress on the solder joints due to the bending.
    Also during panel separation, for example by punching or grinding / sawing, vibration or bending stress can be reduced thanks to the reinforcement material (e.g. globtop).
    In addition, during operation of the electric motor (e.g. fan), the reinforcement material (e.g. glob-top) will strengthen the PCB. Therefore, vibration of the PCB can be reduced. This can be beneficial with reduced acoustic noise and less mechanical wear, resulting in a longer life.
    权利要求:
    Claims (12)
    [1]
    An electronic device (100) that can be mounted in an electric motor, comprising:
    - a printed circuit board (110) with an opening (111) for mounting a semiconductor package (120) comprising an integrated magnetic measuring device, the semiconductor package (120) comprising pins (121),
    - and reinforcement material (130),
    - characterized in that the semiconductor package (120) is mounted in the opening with the pins (121) soldered to the printed circuit board, and a gap (112, 113) is present between the semiconductor package (120) and the printed circuit board (110),
    - and that the reinforcing material (130) covers at least a portion of the pins (121) and at least a portion of the printed circuit board (110) and wherein the reinforcing material (130) is cured after it has been applied in liquid form.
    [2]
    The electronic device (100) of claim 1, wherein the reinforcement material (130) covers at least a portion of the semiconductor package, at least a portion of the slit (112, 113) and at least a portion of the printed circuit board (110).
    [3]
    The electronic device (100) according to any of the preceding claims, wherein the slit (112, 113) is at least partially filled with the reinforcement material (130).
    [4]
    The electronic device (100) according to any of the preceding claims, wherein the reinforcing material (130) comprises a material that changes its material properties and cures after being applied.
    BE2018 / 5892
    [5]
    The electronic device (100) of claim 4, wherein the reinforcing material (130) comprises an epoxy or a resin.
    [6]
    The electronic device (100) according to any of the preceding claims, wherein the printed circuit board (110) comprises only one layer.
    [7]
    The electronic device (100) according to any of the preceding claims, wherein the pins (121) of the semiconductor package (120) are straight pins.
    [8]
    The electronic motor (300) comprising an electronic device (100) according to any one of claims 1 to 7, wherein the electronic device (100) is mounted in a housing of the electronic motor.
    [9]
    A method (200) for producing an electronic device that can be mounted in an electric motor, the method comprising:
    - providing (210) a printed circuit board with an opening for mounting a semiconductor package comprising an integrated magnetic measuring device in the opening,
    - applying (220) a solder paste to the printed circuit board, characterized by:
    - mounting (230) a semiconductor package comprising pins on the printed circuit board so that the pins contact the solder paste and so that a gap is present between the semiconductor package and the printed circuit board,
    - applying (240) reinforcing material so that it covers at least the pins and at least a portion of the printed circuit board,
    BE2018 / 5892 the reinforcing material is such that it changes its material properties and hardens after being applied,
    - flow soldering (250) of the semiconductor package before or after applying the reinforcement material.
    [10]
    The method (200) of claim 9, wherein the flow insulation (250) occurs after the step of applying (240) the reinforcing material.
    [11]
    The method (200) of claim 9, wherein the flow insulation (250) occurs after applying the reinforcement material (240).
    12. Method (200) according to one of the claims 9 until and with 11, at which it reinforcement material is going to be fitted (240) as a liquid. 13. Method (200) according to one of the claims 9 until and with 12, at which it
    reinforcement material is provided (240) so that it covers at least a portion of the semiconductor package, at least a portion of the slit and at least a portion of the printed circuit board.
    [12]
    The method (200) of claim 13, wherein the reinforcement material is disposed (240) on both sides of the semiconductor package and the printed circuit board.
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    同族专利:
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    法律状态:
    2020-04-22| FG| Patent granted|Effective date: 20200309 |
    优先权:
    申请号 | 申请日 | 专利标题
    DE102017130342.1A|DE102017130342A1|2017-12-18|2017-12-18|Reinforced electronic device for an electric motor|
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